Exchange-diffusion reactions in HfSiON during annealing studied by Rutherford backscattering spectrometry, nuclear reaction analysis and narrow resonant nuclear reaction profiling

• Autor(a) principal: Miotti, Leonardo
• Data de Publicação: 2004
• Outros Autores: Bastos, Karen Paz, Soares, Gabriel Vieira, Driemeier, Carlos Eduardo, Pezzi, Rafael Peretti, Morais, Jonder, Baumvol, Israel Jacob Rabin, Rotondaro, Antonio L.P., Visokay, Mark R., Chambers, James Joseph, Quevedo-Lopez, M., Colombo, Luigi
• Tipo de documento: Artigo
• Idioma: eng
• Título da fonte: Repositório Institucional da UFRGS
• Texto Completo: http://hdl.handle.net/10183/141683
• topic: Silício; Filmes finos; Óxido de silício; Retroespalhamento rutherford; Oxinitruro de háfnio silício; Reacoes nucleares

HfSiON films deposited on Si (001) by reactive sputtering were submitted to rapid thermal annealing at 1000 °C in vacuum, N2 and O2 atmospheres. The stability of the dielectric was evaluated by measuring the atomic transport and exchange of the chemical species, using Rutherford backscattering spectrometry, nuclear reaction analysis and narrow resonant nuclear reaction profiling. Annealing in O2 ambient reduced the N concentration mainly from near-surface regions where oxygen was incorporated in comparable amounts. Vacuum annealing, on the other hand, induced N loss preferentially from the Si/dielectric interface and O loss preferentially from near-surface regions. The results are explained in terms of exchange-diffusion reactions occurring in the HfSiON.