Effect of Diode Laser Irradiation of Bonding Agents Before Curing Versus Standard Bonding Protocol on the Shear Bond Strength Between Resin Cement and Dentin
Autor(a) principal: | |
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Data de Publicação: | 2019 |
Outros Autores: | , |
Tipo de documento: | Artigo |
Idioma: | eng |
Título da fonte: | Brazilian Dental Science |
Texto Completo: | https://ojs.ict.unesp.br/index.php/cob/article/view/1796 |
Resumo: | Objective: This study aimed to evaluate the effect of diode laser irradiation (970 nm) of a one-step self-etch adhesive (Clearfil S3Bond/CS3B) and of the bonding agent of a two-step self-etch adhesive (Clearfil Liner Bond F/CLBF) placed on dentin before polymerization on the shear bond strength.Material and methods: Forty sound premolars were sectioned buccally to obtain flat dentin surfaces. The specimens were divided into 4 groups (n=10): Group (OS) – CS3B + polymerization. Group (OS-L) – CS3B + laser + polymerization. Group (TS) – CLBF (bonding agent only) + polymerization. Group (TS-L) – CLBF (bonding agent only) + laser + polymerization. The diode laser was irradiated through an 8 mm bleaching tip for 10 seconds, (0.4 W, 10 Hz, 4 J). All samples were cemented to composite blocks submitted to 4000 thermal cycles. The samples were tested for shear bond strength in a universal testing machine. Data obtained was analyzed using Two-way (ANOVA) (P ? 0.05) and the Bonferroni post-hoc test. Representative samples from each group were analyzed using scanning electron microscopy (SEM). Results: GroupTS-L– (7.43 MPa) displayed statistically significant higher shear bond strength in comparison to that of group TS – (5.13 MPa). No statistically significant difference was found between group OS-L – (6.49 MPa) and group OS – (7.28 MPa). Group TS-L exhibited the highest resin penetration beyond the hybrid layer under SEM. Conclusions: Diode laser irradiation of a bonding agent placed on dentin without prior priming increased the bond strength to dentin and is promising as a new dentin adhesion protocol. |
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oai:ojs.pkp.sfu.ca:article/1796 |
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UNESP-20 |
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Brazilian Dental Science |
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Effect of Diode Laser Irradiation of Bonding Agents Before Curing Versus Standard Bonding Protocol on the Shear Bond Strength Between Resin Cement and DentinObjective: This study aimed to evaluate the effect of diode laser irradiation (970 nm) of a one-step self-etch adhesive (Clearfil S3Bond/CS3B) and of the bonding agent of a two-step self-etch adhesive (Clearfil Liner Bond F/CLBF) placed on dentin before polymerization on the shear bond strength.Material and methods: Forty sound premolars were sectioned buccally to obtain flat dentin surfaces. The specimens were divided into 4 groups (n=10): Group (OS) – CS3B + polymerization. Group (OS-L) – CS3B + laser + polymerization. Group (TS) – CLBF (bonding agent only) + polymerization. Group (TS-L) – CLBF (bonding agent only) + laser + polymerization. The diode laser was irradiated through an 8 mm bleaching tip for 10 seconds, (0.4 W, 10 Hz, 4 J). All samples were cemented to composite blocks submitted to 4000 thermal cycles. The samples were tested for shear bond strength in a universal testing machine. Data obtained was analyzed using Two-way (ANOVA) (P ? 0.05) and the Bonferroni post-hoc test. Representative samples from each group were analyzed using scanning electron microscopy (SEM). Results: GroupTS-L– (7.43 MPa) displayed statistically significant higher shear bond strength in comparison to that of group TS – (5.13 MPa). No statistically significant difference was found between group OS-L – (6.49 MPa) and group OS – (7.28 MPa). Group TS-L exhibited the highest resin penetration beyond the hybrid layer under SEM. Conclusions: Diode laser irradiation of a bonding agent placed on dentin without prior priming increased the bond strength to dentin and is promising as a new dentin adhesion protocol.Institute of Science and Technology of São José dos Campos2019-07-30info:eu-repo/semantics/articleinfo:eu-repo/semantics/publishedVersionapplication/pdfimage/jpegapplication/vnd.openxmlformats-officedocument.wordprocessingml.documentimage/jpegimage/tiffimage/jpegimage/jpegimage/jpegimage/jpeghttps://ojs.ict.unesp.br/index.php/cob/article/view/179610.14295/bds.2019.v22i3.1796Brazilian Dental Science; Vol. 22 No. 3 (2019): Jul. - Sep. / 2019 - Published July 2019; 395-407Brazilian Dental Science; v. 22 n. 3 (2019): Jul. - Sep. / 2019 - Published July 2019; 395-4072178-6011reponame:Brazilian Dental Scienceinstname:Universidade Estadual Paulista Júlio de Mesquita Filho (UNESP)instacron:UNESPenghttps://ojs.ict.unesp.br/index.php/cob/article/view/1796/1386https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3735https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3736https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3738https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3743https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3744https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3745https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3746https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3747Copyright (c) 2019 Brazilian Dental Scienceinfo:eu-repo/semantics/openAccessEl-Hakim, Nada MagedMokhtar, AshrafHamza, Tamer2020-01-28T12:01:15Zoai:ojs.pkp.sfu.ca:article/1796Revistahttp://bds.ict.unesp.br/PUBhttp://ojs.fosjc.unesp.br/index.php/index/oaisergio@fosjc.unesp.br||sergio@fosjc.unesp.br2178-60112178-6011opendoar:2022-11-08T16:30:23.723226Brazilian Dental Science - Universidade Estadual Paulista Júlio de Mesquita Filho (UNESP)true |
dc.title.none.fl_str_mv |
Effect of Diode Laser Irradiation of Bonding Agents Before Curing Versus Standard Bonding Protocol on the Shear Bond Strength Between Resin Cement and Dentin |
title |
Effect of Diode Laser Irradiation of Bonding Agents Before Curing Versus Standard Bonding Protocol on the Shear Bond Strength Between Resin Cement and Dentin |
spellingShingle |
Effect of Diode Laser Irradiation of Bonding Agents Before Curing Versus Standard Bonding Protocol on the Shear Bond Strength Between Resin Cement and Dentin El-Hakim, Nada Maged |
title_short |
Effect of Diode Laser Irradiation of Bonding Agents Before Curing Versus Standard Bonding Protocol on the Shear Bond Strength Between Resin Cement and Dentin |
title_full |
Effect of Diode Laser Irradiation of Bonding Agents Before Curing Versus Standard Bonding Protocol on the Shear Bond Strength Between Resin Cement and Dentin |
title_fullStr |
Effect of Diode Laser Irradiation of Bonding Agents Before Curing Versus Standard Bonding Protocol on the Shear Bond Strength Between Resin Cement and Dentin |
title_full_unstemmed |
Effect of Diode Laser Irradiation of Bonding Agents Before Curing Versus Standard Bonding Protocol on the Shear Bond Strength Between Resin Cement and Dentin |
title_sort |
Effect of Diode Laser Irradiation of Bonding Agents Before Curing Versus Standard Bonding Protocol on the Shear Bond Strength Between Resin Cement and Dentin |
author |
El-Hakim, Nada Maged |
author_facet |
El-Hakim, Nada Maged Mokhtar, Ashraf Hamza, Tamer |
author_role |
author |
author2 |
Mokhtar, Ashraf Hamza, Tamer |
author2_role |
author author |
dc.contributor.author.fl_str_mv |
El-Hakim, Nada Maged Mokhtar, Ashraf Hamza, Tamer |
description |
Objective: This study aimed to evaluate the effect of diode laser irradiation (970 nm) of a one-step self-etch adhesive (Clearfil S3Bond/CS3B) and of the bonding agent of a two-step self-etch adhesive (Clearfil Liner Bond F/CLBF) placed on dentin before polymerization on the shear bond strength.Material and methods: Forty sound premolars were sectioned buccally to obtain flat dentin surfaces. The specimens were divided into 4 groups (n=10): Group (OS) – CS3B + polymerization. Group (OS-L) – CS3B + laser + polymerization. Group (TS) – CLBF (bonding agent only) + polymerization. Group (TS-L) – CLBF (bonding agent only) + laser + polymerization. The diode laser was irradiated through an 8 mm bleaching tip for 10 seconds, (0.4 W, 10 Hz, 4 J). All samples were cemented to composite blocks submitted to 4000 thermal cycles. The samples were tested for shear bond strength in a universal testing machine. Data obtained was analyzed using Two-way (ANOVA) (P ? 0.05) and the Bonferroni post-hoc test. Representative samples from each group were analyzed using scanning electron microscopy (SEM). Results: GroupTS-L– (7.43 MPa) displayed statistically significant higher shear bond strength in comparison to that of group TS – (5.13 MPa). No statistically significant difference was found between group OS-L – (6.49 MPa) and group OS – (7.28 MPa). Group TS-L exhibited the highest resin penetration beyond the hybrid layer under SEM. Conclusions: Diode laser irradiation of a bonding agent placed on dentin without prior priming increased the bond strength to dentin and is promising as a new dentin adhesion protocol. |
publishDate |
2019 |
dc.date.none.fl_str_mv |
2019-07-30 |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/article info:eu-repo/semantics/publishedVersion |
format |
article |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
https://ojs.ict.unesp.br/index.php/cob/article/view/1796 10.14295/bds.2019.v22i3.1796 |
url |
https://ojs.ict.unesp.br/index.php/cob/article/view/1796 |
identifier_str_mv |
10.14295/bds.2019.v22i3.1796 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
https://ojs.ict.unesp.br/index.php/cob/article/view/1796/1386 https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3735 https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3736 https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3738 https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3743 https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3744 https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3745 https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3746 https://ojs.ict.unesp.br/index.php/cob/article/view/1796/3747 |
dc.rights.driver.fl_str_mv |
Copyright (c) 2019 Brazilian Dental Science info:eu-repo/semantics/openAccess |
rights_invalid_str_mv |
Copyright (c) 2019 Brazilian Dental Science |
eu_rights_str_mv |
openAccess |
dc.format.none.fl_str_mv |
application/pdf image/jpeg application/vnd.openxmlformats-officedocument.wordprocessingml.document image/jpeg image/tiff image/jpeg image/jpeg image/jpeg image/jpeg |
dc.publisher.none.fl_str_mv |
Institute of Science and Technology of São José dos Campos |
publisher.none.fl_str_mv |
Institute of Science and Technology of São José dos Campos |
dc.source.none.fl_str_mv |
Brazilian Dental Science; Vol. 22 No. 3 (2019): Jul. - Sep. / 2019 - Published July 2019; 395-407 Brazilian Dental Science; v. 22 n. 3 (2019): Jul. - Sep. / 2019 - Published July 2019; 395-407 2178-6011 reponame:Brazilian Dental Science instname:Universidade Estadual Paulista Júlio de Mesquita Filho (UNESP) instacron:UNESP |
instname_str |
Universidade Estadual Paulista Júlio de Mesquita Filho (UNESP) |
instacron_str |
UNESP |
institution |
UNESP |
reponame_str |
Brazilian Dental Science |
collection |
Brazilian Dental Science |
repository.name.fl_str_mv |
Brazilian Dental Science - Universidade Estadual Paulista Júlio de Mesquita Filho (UNESP) |
repository.mail.fl_str_mv |
sergio@fosjc.unesp.br||sergio@fosjc.unesp.br |
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1788346900856963072 |