Output conductance of line-TFETs for different device parameters and its effect on basic analog circuits

Detalhes bibliográficos
Autor(a) principal: Gonçalez Filho, W.
Data de Publicação: 2020
Outros Autores: Martino, J. A., Agopian, P. G.D. [UNESP]
Tipo de documento: Artigo
Idioma: eng
Título da fonte: Repositório Institucional da UNESP
Texto Completo: http://dx.doi.org/10.29292/jics.v15i1.112
http://hdl.handle.net/11449/198918
Resumo: This work addresses the impact of different device parameters on the analog characteristics of Line-Tunneling Field Effect Transistors (Line-TFETs). It was shown that in-creasing source-to-drain separation from 25 nm to 45 nm re-duces output conductance degradation for high drain voltages but increases the saturation voltage in about 400 mV due to the increase in the inner resistance. Variation of 4nm in the pocket thickness, a major cause of device variability, resulted in a 50-fold reduction of the drain current, but the output conductance reaches the same value in all cases for sufficiently high Vds. The variation of the main parameters responsible for device variability (pocket thickness and doping and gate-source alignment) is performed in order to analyze their impact on current mir-rors, revealing that gate-source overlap of 3 nm decreases the minimum output voltage from 820 mV to 300 mV, in comparison with no misalignment and improves the analog characteristics of the Line-TFET by preventing output conductance degradation for high drain voltages. Simulations compared to ex-perimental data show that the output conductance (gd) of Line-TFETs is practically independent of the gate length. Simulations reveal that this unique characteristic is due to source-to-drain tunneling, which defines the average value of gd on the saturation-like region and does not depend upon the gate length. The impact of this characteristic on the design of a com-mon-source stage is shown by comparing with a MOSFET de-sign. This example shows that the designer may choose whether to increase gm or gd in order to increase the circuit gain when using Line-TFETs, fundamentally differing from the MOSFET case.
id UNSP_caf3e1271e69d8f9ca0591f704a68e25
oai_identifier_str oai:repositorio.unesp.br:11449/198918
network_acronym_str UNSP
network_name_str Repositório Institucional da UNESP
repository_id_str 2946
spelling Output conductance of line-TFETs for different device parameters and its effect on basic analog circuitsAnalog de-signLine-TFETOutput conductanceThis work addresses the impact of different device parameters on the analog characteristics of Line-Tunneling Field Effect Transistors (Line-TFETs). It was shown that in-creasing source-to-drain separation from 25 nm to 45 nm re-duces output conductance degradation for high drain voltages but increases the saturation voltage in about 400 mV due to the increase in the inner resistance. Variation of 4nm in the pocket thickness, a major cause of device variability, resulted in a 50-fold reduction of the drain current, but the output conductance reaches the same value in all cases for sufficiently high Vds. The variation of the main parameters responsible for device variability (pocket thickness and doping and gate-source alignment) is performed in order to analyze their impact on current mir-rors, revealing that gate-source overlap of 3 nm decreases the minimum output voltage from 820 mV to 300 mV, in comparison with no misalignment and improves the analog characteristics of the Line-TFET by preventing output conductance degradation for high drain voltages. Simulations compared to ex-perimental data show that the output conductance (gd) of Line-TFETs is practically independent of the gate length. Simulations reveal that this unique characteristic is due to source-to-drain tunneling, which defines the average value of gd on the saturation-like region and does not depend upon the gate length. The impact of this characteristic on the design of a com-mon-source stage is shown by comparing with a MOSFET de-sign. This example shows that the designer may choose whether to increase gm or gd in order to increase the circuit gain when using Line-TFETs, fundamentally differing from the MOSFET case.Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)LSI/PSI/USP University of São PauloUNESP Sao Paulo State UniversityUNESP Sao Paulo State UniversityUniversidade de São Paulo (USP)Universidade Estadual Paulista (Unesp)Gonçalez Filho, W.Martino, J. A.Agopian, P. G.D. [UNESP]2020-12-12T01:25:28Z2020-12-12T01:25:28Z2020-01-01info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/articlehttp://dx.doi.org/10.29292/jics.v15i1.112Journal of Integrated Circuits and Systems, v. 15, n. 1, 2020.1872-02341807-1953http://hdl.handle.net/11449/19891810.29292/jics.v15i1.1122-s2.0-85085771389Scopusreponame:Repositório Institucional da UNESPinstname:Universidade Estadual Paulista (UNESP)instacron:UNESPengJournal of Integrated Circuits and Systemsinfo:eu-repo/semantics/openAccess2021-10-22T21:02:59Zoai:repositorio.unesp.br:11449/198918Repositório InstitucionalPUBhttp://repositorio.unesp.br/oai/requestopendoar:29462021-10-22T21:02:59Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)false
dc.title.none.fl_str_mv Output conductance of line-TFETs for different device parameters and its effect on basic analog circuits
title Output conductance of line-TFETs for different device parameters and its effect on basic analog circuits
spellingShingle Output conductance of line-TFETs for different device parameters and its effect on basic analog circuits
Gonçalez Filho, W.
Analog de-sign
Line-TFET
Output conductance
title_short Output conductance of line-TFETs for different device parameters and its effect on basic analog circuits
title_full Output conductance of line-TFETs for different device parameters and its effect on basic analog circuits
title_fullStr Output conductance of line-TFETs for different device parameters and its effect on basic analog circuits
title_full_unstemmed Output conductance of line-TFETs for different device parameters and its effect on basic analog circuits
title_sort Output conductance of line-TFETs for different device parameters and its effect on basic analog circuits
author Gonçalez Filho, W.
author_facet Gonçalez Filho, W.
Martino, J. A.
Agopian, P. G.D. [UNESP]
author_role author
author2 Martino, J. A.
Agopian, P. G.D. [UNESP]
author2_role author
author
dc.contributor.none.fl_str_mv Universidade de São Paulo (USP)
Universidade Estadual Paulista (Unesp)
dc.contributor.author.fl_str_mv Gonçalez Filho, W.
Martino, J. A.
Agopian, P. G.D. [UNESP]
dc.subject.por.fl_str_mv Analog de-sign
Line-TFET
Output conductance
topic Analog de-sign
Line-TFET
Output conductance
description This work addresses the impact of different device parameters on the analog characteristics of Line-Tunneling Field Effect Transistors (Line-TFETs). It was shown that in-creasing source-to-drain separation from 25 nm to 45 nm re-duces output conductance degradation for high drain voltages but increases the saturation voltage in about 400 mV due to the increase in the inner resistance. Variation of 4nm in the pocket thickness, a major cause of device variability, resulted in a 50-fold reduction of the drain current, but the output conductance reaches the same value in all cases for sufficiently high Vds. The variation of the main parameters responsible for device variability (pocket thickness and doping and gate-source alignment) is performed in order to analyze their impact on current mir-rors, revealing that gate-source overlap of 3 nm decreases the minimum output voltage from 820 mV to 300 mV, in comparison with no misalignment and improves the analog characteristics of the Line-TFET by preventing output conductance degradation for high drain voltages. Simulations compared to ex-perimental data show that the output conductance (gd) of Line-TFETs is practically independent of the gate length. Simulations reveal that this unique characteristic is due to source-to-drain tunneling, which defines the average value of gd on the saturation-like region and does not depend upon the gate length. The impact of this characteristic on the design of a com-mon-source stage is shown by comparing with a MOSFET de-sign. This example shows that the designer may choose whether to increase gm or gd in order to increase the circuit gain when using Line-TFETs, fundamentally differing from the MOSFET case.
publishDate 2020
dc.date.none.fl_str_mv 2020-12-12T01:25:28Z
2020-12-12T01:25:28Z
2020-01-01
dc.type.status.fl_str_mv info:eu-repo/semantics/publishedVersion
dc.type.driver.fl_str_mv info:eu-repo/semantics/article
format article
status_str publishedVersion
dc.identifier.uri.fl_str_mv http://dx.doi.org/10.29292/jics.v15i1.112
Journal of Integrated Circuits and Systems, v. 15, n. 1, 2020.
1872-0234
1807-1953
http://hdl.handle.net/11449/198918
10.29292/jics.v15i1.112
2-s2.0-85085771389
url http://dx.doi.org/10.29292/jics.v15i1.112
http://hdl.handle.net/11449/198918
identifier_str_mv Journal of Integrated Circuits and Systems, v. 15, n. 1, 2020.
1872-0234
1807-1953
10.29292/jics.v15i1.112
2-s2.0-85085771389
dc.language.iso.fl_str_mv eng
language eng
dc.relation.none.fl_str_mv Journal of Integrated Circuits and Systems
dc.rights.driver.fl_str_mv info:eu-repo/semantics/openAccess
eu_rights_str_mv openAccess
dc.source.none.fl_str_mv Scopus
reponame:Repositório Institucional da UNESP
instname:Universidade Estadual Paulista (UNESP)
instacron:UNESP
instname_str Universidade Estadual Paulista (UNESP)
instacron_str UNESP
institution UNESP
reponame_str Repositório Institucional da UNESP
collection Repositório Institucional da UNESP
repository.name.fl_str_mv Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)
repository.mail.fl_str_mv
_version_ 1803650070851092480