Aplicação da ferramenta diagrama de ISHIKAWA em um processo de smt (surface mount technology)

• Autor(a) principal: Vasconcelos, Carlos Wandel Trindade de
• Data de Publicação: 2021
• Tipo de documento: Trabalho de conclusão de curso
• Idioma: por
• Título da fonte: Repositório Institucional do IFAM (Repositório Institucional do Instituto Federal do Amazonas)
• Texto Completo: http://repositorio.ifam.edu.br/jspui/handle/4321/677
• topic: Diagrama de Ishikawa; Processo de Produção; Não conformidades; Produção; CNPQ::ENGENHARIAS::ENGENHARIA ELETRICA::ELETRONICA INDUSTRIAL, SISTEMAS E CONTROLES ELETRONICOS::ELETRONICA INDUSTRIAL

From the physical change of components, the need arose for new tools both for assembly and for reworking plates that have SMT components (Surface Mount Tecnology). In SMT the terminals do not cross the plate, they have shapes that allow them to be welded on the surface of the plate, one side of the plate is useless. Due to this factor, this research was initiated, whose general objective was to apply the Ishikawa Diagram tool in an SMT process to point out the number of non-conformities in the welding process of a production line, of a particular product in the receiver segment. Digital TV from an electronics industry in the Manaus SCP industrial hub. In order to achieve this macro objective, specific objectives were created: (1) to present the SMT assembly and welding process; (2) describe the types of assembly, boards and printed circuits and (3) identify the benefits of the Ishikawa Diagram for the quality process. The methodology used for this study, is classified according to nature, as qualitative research, of descriptive and exploratory purpose, from the realization of a field research, using as a data collection technique, a case study, from observations, documentation data and photographic records in an electronics industry located in the industrial pole of Manaus. As a result, it is stated that, through the application of the Ishikawa Diagram tool, it is possible to identify where losses occur in the production processes of the electronics industry, from the specific points of the production line, allowing to suggest an action plan to solve responsible failures due to non-conformities in SMT plate welding processes, increasing productivity. It is concluded that this methodology is an administrative method that assists in the resolution, mapping of difficulties, acts as an identification tool in an assertive manner, guaranteeing the best reliability of operations and production processes.