OPPOSITE TRENDS BETWEEN DIGITAL AND ANALOG PERFORMANCE FOR DIFFERENT TFET TECHNOLOGIES
Autor(a) principal: | |
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Data de Publicação: | 2018 |
Outros Autores: | , , , , , , , , , , , , , , , , |
Tipo de documento: | Artigo de conferência |
Idioma: | eng |
Título da fonte: | Repositório Institucional da UNESP |
Texto Completo: | http://hdl.handle.net/11449/218327 |
Resumo: | Different Tunnel-FET technologies are analyzed in terms of digital and analog figures of merit. The digital figure of merit used was the subthreshold swing (SS), while the analog parameter was the intrinsic voltage gain (AV). In the early technologies based on silicon TFET devices, the SS was much higher than the ideal behavior. However, the Av was very good, reaching a value up to 80 dB. The opposite trends were observed for up to date technologies based on III-V materials, where the SS finally reaches values down to 60 mV/dec while the AV degrades to 32 dB. The explanation is related to the predominant conduction mechanism. In the III-V TFETs, Band to Band (B2B) Tunneling is the predominant mechanism, which is more sensible to the drain electric field, increasing the output conductance and degrading the AV. In the silicon based TFETs the Trap-Assisted-Tunneling (TAT) is the predominant mechanism, which is less dependent on the drain electric field, resulting in a better AV. |
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Repositório Institucional da UNESP |
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OPPOSITE TRENDS BETWEEN DIGITAL AND ANALOG PERFORMANCE FOR DIFFERENT TFET TECHNOLOGIESTFETgeometriesnew materialsdigital and analog performanceDifferent Tunnel-FET technologies are analyzed in terms of digital and analog figures of merit. The digital figure of merit used was the subthreshold swing (SS), while the analog parameter was the intrinsic voltage gain (AV). In the early technologies based on silicon TFET devices, the SS was much higher than the ideal behavior. However, the Av was very good, reaching a value up to 80 dB. The opposite trends were observed for up to date technologies based on III-V materials, where the SS finally reaches values down to 60 mV/dec while the AV degrades to 32 dB. The explanation is related to the predominant conduction mechanism. In the III-V TFETs, Band to Band (B2B) Tunneling is the predominant mechanism, which is more sensible to the drain electric field, increasing the output conductance and degrading the AV. In the silicon based TFETs the Trap-Assisted-Tunneling (TAT) is the predominant mechanism, which is less dependent on the drain electric field, resulting in a better AV.Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)imec's Logic Device Program and its Core PartnersUniv Sao Paulo, LSI PSI USP, Sao Paulo, BrazilSao Paulo State Univ, UNESP, Campus Sao Joao da Boa Vista, Sao Paulo, BrazilIMEC, Leuven, BelgiumKatholieke Univ Leuven, EE Dept, Leuven, BelgiumSao Paulo State Univ, UNESP, Campus Sao Joao da Boa Vista, Sao Paulo, BrazilIeeeUniversidade de São Paulo (USP)Universidade Estadual Paulista (UNESP)IMECKatholieke Univ LeuvenAgopian, P. G. D. [UNESP]Bordallo, C.Martino, J. A.Rooyackers, R.Simoen, E.Collaert, N.Claeys, C.Huang, R.Wu, H.Lin, Q.Liang, S.Song, P. L.Guo, Z.Lai, K.Zhang, Y.Wang, Y.Shi, Y.Lung, H. L.2022-04-28T17:20:27Z2022-04-28T17:20:27Z2018-01-01info:eu-repo/semantics/publishedVersioninfo:eu-repo/semantics/conferenceObject42018 China Semiconductor Technology International Conference (cstic). New York: Ieee, 4 p., 2018.http://hdl.handle.net/11449/218327WOS:000682776100019Web of Sciencereponame:Repositório Institucional da UNESPinstname:Universidade Estadual Paulista (UNESP)instacron:UNESPeng2018 China Semiconductor Technology International Conference (cstic)info:eu-repo/semantics/openAccess2022-04-28T17:20:27Zoai:repositorio.unesp.br:11449/218327Repositório InstitucionalPUBhttp://repositorio.unesp.br/oai/requestopendoar:29462024-08-05T22:30:12.382947Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP)false |
dc.title.none.fl_str_mv |
OPPOSITE TRENDS BETWEEN DIGITAL AND ANALOG PERFORMANCE FOR DIFFERENT TFET TECHNOLOGIES |
title |
OPPOSITE TRENDS BETWEEN DIGITAL AND ANALOG PERFORMANCE FOR DIFFERENT TFET TECHNOLOGIES |
spellingShingle |
OPPOSITE TRENDS BETWEEN DIGITAL AND ANALOG PERFORMANCE FOR DIFFERENT TFET TECHNOLOGIES Agopian, P. G. D. [UNESP] TFET geometries new materials digital and analog performance |
title_short |
OPPOSITE TRENDS BETWEEN DIGITAL AND ANALOG PERFORMANCE FOR DIFFERENT TFET TECHNOLOGIES |
title_full |
OPPOSITE TRENDS BETWEEN DIGITAL AND ANALOG PERFORMANCE FOR DIFFERENT TFET TECHNOLOGIES |
title_fullStr |
OPPOSITE TRENDS BETWEEN DIGITAL AND ANALOG PERFORMANCE FOR DIFFERENT TFET TECHNOLOGIES |
title_full_unstemmed |
OPPOSITE TRENDS BETWEEN DIGITAL AND ANALOG PERFORMANCE FOR DIFFERENT TFET TECHNOLOGIES |
title_sort |
OPPOSITE TRENDS BETWEEN DIGITAL AND ANALOG PERFORMANCE FOR DIFFERENT TFET TECHNOLOGIES |
author |
Agopian, P. G. D. [UNESP] |
author_facet |
Agopian, P. G. D. [UNESP] Bordallo, C. Martino, J. A. Rooyackers, R. Simoen, E. Collaert, N. Claeys, C. Huang, R. Wu, H. Lin, Q. Liang, S. Song, P. L. Guo, Z. Lai, K. Zhang, Y. Wang, Y. Shi, Y. Lung, H. L. |
author_role |
author |
author2 |
Bordallo, C. Martino, J. A. Rooyackers, R. Simoen, E. Collaert, N. Claeys, C. Huang, R. Wu, H. Lin, Q. Liang, S. Song, P. L. Guo, Z. Lai, K. Zhang, Y. Wang, Y. Shi, Y. Lung, H. L. |
author2_role |
author author author author author author author author author author author author author author author author author |
dc.contributor.none.fl_str_mv |
Universidade de São Paulo (USP) Universidade Estadual Paulista (UNESP) IMEC Katholieke Univ Leuven |
dc.contributor.author.fl_str_mv |
Agopian, P. G. D. [UNESP] Bordallo, C. Martino, J. A. Rooyackers, R. Simoen, E. Collaert, N. Claeys, C. Huang, R. Wu, H. Lin, Q. Liang, S. Song, P. L. Guo, Z. Lai, K. Zhang, Y. Wang, Y. Shi, Y. Lung, H. L. |
dc.subject.por.fl_str_mv |
TFET geometries new materials digital and analog performance |
topic |
TFET geometries new materials digital and analog performance |
description |
Different Tunnel-FET technologies are analyzed in terms of digital and analog figures of merit. The digital figure of merit used was the subthreshold swing (SS), while the analog parameter was the intrinsic voltage gain (AV). In the early technologies based on silicon TFET devices, the SS was much higher than the ideal behavior. However, the Av was very good, reaching a value up to 80 dB. The opposite trends were observed for up to date technologies based on III-V materials, where the SS finally reaches values down to 60 mV/dec while the AV degrades to 32 dB. The explanation is related to the predominant conduction mechanism. In the III-V TFETs, Band to Band (B2B) Tunneling is the predominant mechanism, which is more sensible to the drain electric field, increasing the output conductance and degrading the AV. In the silicon based TFETs the Trap-Assisted-Tunneling (TAT) is the predominant mechanism, which is less dependent on the drain electric field, resulting in a better AV. |
publishDate |
2018 |
dc.date.none.fl_str_mv |
2018-01-01 2022-04-28T17:20:27Z 2022-04-28T17:20:27Z |
dc.type.status.fl_str_mv |
info:eu-repo/semantics/publishedVersion |
dc.type.driver.fl_str_mv |
info:eu-repo/semantics/conferenceObject |
format |
conferenceObject |
status_str |
publishedVersion |
dc.identifier.uri.fl_str_mv |
2018 China Semiconductor Technology International Conference (cstic). New York: Ieee, 4 p., 2018. http://hdl.handle.net/11449/218327 WOS:000682776100019 |
identifier_str_mv |
2018 China Semiconductor Technology International Conference (cstic). New York: Ieee, 4 p., 2018. WOS:000682776100019 |
url |
http://hdl.handle.net/11449/218327 |
dc.language.iso.fl_str_mv |
eng |
language |
eng |
dc.relation.none.fl_str_mv |
2018 China Semiconductor Technology International Conference (cstic) |
dc.rights.driver.fl_str_mv |
info:eu-repo/semantics/openAccess |
eu_rights_str_mv |
openAccess |
dc.format.none.fl_str_mv |
4 |
dc.publisher.none.fl_str_mv |
Ieee |
publisher.none.fl_str_mv |
Ieee |
dc.source.none.fl_str_mv |
Web of Science reponame:Repositório Institucional da UNESP instname:Universidade Estadual Paulista (UNESP) instacron:UNESP |
instname_str |
Universidade Estadual Paulista (UNESP) |
instacron_str |
UNESP |
institution |
UNESP |
reponame_str |
Repositório Institucional da UNESP |
collection |
Repositório Institucional da UNESP |
repository.name.fl_str_mv |
Repositório Institucional da UNESP - Universidade Estadual Paulista (UNESP) |
repository.mail.fl_str_mv |
|
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1808129432363204608 |